产品描述FeaturesUnique pressure and temperature uniformityCompatible with EVG mechanical and optical alignersFlexible design......
产品描述EVG®810 LTFeaturesSurface plasma activation for low-temperature bonding (fusion/molecular and intermediate layer bon......
产品描述EVG®850 TB临时键合机FeaturesOpen adhesive platformVarious carriers (silicon, glass, sapphire, etc…)Bridge tool capability......